Magnetron sputtering coating machine is especially suitable for reactive deposition coating. In fact, this process equipment can deposit any oxide, carbide and nitride film. In addition, this process is especially suitable for the deposition of multilayer film structures, including optical design, color film, wear-resistant coating, nano-lamination, superlattice coating, insulating film and so on. As early as 1970, there were cases of high-quality optical film deposition. A variety of optical film materials have been developed, including transparent conductive materials, semiconductors, polymers, oxides, carbides, nitrides, etc.

Magnetron sputtering coating machine has the following characteristics:

1. The deposition rate is high.

2. High power. Magnetron sputtering targets generally choose a voltage in the range of 200 -1000 volts, usually 600 volts, because the voltage of 600 volts is just in the highest effective range of power efficiency.

3. Low sputtering energy. The target voltage of magnetron is low, and the magnetic field limits the plasma near the cathode, which can prevent charged particles with higher energy from entering the substrate.

4. The substrate temperature is low. The impact of electrons on the base material can be effectively reduced by using the electrons generated during the anode conductive discharge without grounding the base. Therefore, the substrate has a low temperature and is very suitable for coating some plastic substrates with poor high temperature resistance.

5. Uneven etching of magnetron sputtering target surface. The uneven surface etching of magnetron sputtering target is caused by the uneven magnetic field of the target, and the high etching rate of local position of the target makes the effective utilization rate of the target low (the utilization rate is only 20%-30%). Therefore, in order to improve the utilization rate of the target, it is necessary to change the magnetic field distribution or move the magnets in the cathode by certain means, which can also improve the utilization rate of the target.

6. Composite target plating alloy film can be made.

7. Wide application range. Magnetron sputtering contains many precipitable elements, such as Ag, Au, C, Co, Cu, Fe, Ge, Mo, Nb, Ni, Os, Cr, Pd, Pt, Re, Rh, Si, Ta, Ti, Zr, SiO, AlO, GaAs, U, W, SnO, etc.